東京工業大学 工学院 機械系 伏信研究室

Activity

Selected recent research topics

Electronic packaging in automotive/mobility

  • Thermal engineering for the advanced automotive electronic packaging
  • Multiphysics analysis for electronic packaging
  • Novel multiscale properties mapping by means of NID technique

Digital printing

  • Novel digital/functional printing technology
  • Thermofluid phenomena of complex liquid droplet/film systems

Visualization for heat and mass transfer

  • Transport phenomena at microscale gas liquid interface
  • Laser diagnosis of fluid flow in microscale droplet on the solid surface

Photonic production/metrology

  • Additive/subtractive manufacturing by means of ultrashort pulse lasers
  • Multiscale metrology by means of advanced thermoreflectance technique
  • Manufacturing of nanoscale semiconductor device
  • Photon-phonon interfaces for advanced electronics

Optomechanics (in collaboration with external partner)

  • Sensing applications using nanocavities

Energy

  • Multiphysics analysis for advanced energy systems

(Various other research topics are currently under way to be posted later on our website.)
Tokyo Institute of Technology Researcher’s Database

Recent activities

Selected Links

  • IEEE ITherm 2020 @ Lake Buena Vista, FL (May 26-29, 2020) / co-located with ECTC 2020
  • ISTP30 (International Symposium on Transport Phenomena) @Vietnam (Nov 1-3, 2019)
  • ASME InterPACK2019 @Anaheim, CA (Oct 7-9, 2019)
  • ISTP (The 29th International Symposium on Transport Phenomena)
  • 7th US-Japan Seminar (Dec 11-14, 2011)
  • AOTULE (The Asia-Oceania Top University League on Engineering)
  • Thermal Engineering Division, Japan Society of Mechanical Engineers
  • 6th US-Japan Seminar (July 13-16, 2008)
Copyright © 2021 FEPL. All Rights Reserved.